Showing results: 76 - 90 of 137 items found.
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MC400 -
Manncorp
The MC400 Pick and Place machine places an enormous range of components, quickly and accurately, from 0201s through 100 x 150 mm SMDs, including BGAs, MBGAs, CSPs, µBGAs, MLFs, flip chips, odd form components and ultra-fine-pitch parts down to 15 mil. The system is easy to program and operate and comes standard with universal CAD conversion and teach-in capability.
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Mornsun Guangzhou Science & Technology
MORNSUN launched the self-designed electronic integrated circuits according to the different product lines, types of the integrated circuit include AC/DC power supply control ICs, DC/DC power supply control ICs, interface ICs, start-up ICs, contactor power saving controller ICs and digital isolator ICs. MORNSUN IC chip can be widely used in industrial equipment, process control, data acquisition system, building automation, smart meter, etc. Adopting MORNSUN's AC/DC transformers and DC/DC transformers, with the use of its control ICs, can achieve wide voltage input flyback power supply design with multiple protection functions and superior EMI performance. We hope that those power transformers along with the integrated circuits & chips electronics can be an ideal fit for your application needs.
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1024L1 -
Princeton Infrared Technologies, Inc.
The 1024L1 is a 1024x1 state of the art InGaAs linear array imager on 12.5 µm pitch that was built for both spectroscopy and machine vision in the short wave infrared band. The 1024L1-12.5-T is an advanced digital array with the lowest read noise available <110e- for a 250 μm tall pixel. Our new advanced SWIR On-chip Noise Suppression Circuit will enable some spectroscopic applications to see read noise levels <80e-. A single ROIC chip is used thus minimizing variation from output to output found on linear arrays with multiple ROICs. The chips have built in 14bit A/Ds that are designed for the system thus maximizing dynamic range and minimizing the noise while enabling 34k lines/s at 1024 elements. Multiple full well capacities from 75ke- to 100Me- with 128 steps are available to optimize the array for the signal levels. On chip optical pixel binning (where every other detector is disconnected from the ROIC thus signal is captured by neighboring pixels) is available by command to trade spectral resolution for increased signal level. Pixel skipping or binning is also available allowing for 48k lines/s at 512 resolution on the same imager.
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Xeltek
Until now,Support 396 IC manufacturer, 94596 pcs devices and keeps growing.Support devices with Vcc from 1.2V to 5V. The programming speed up further increase 30% compared to SUPERPRO 5000.The programmer support files up to 256 GBytesBuilt with 144 universal pin-drivers.Universal adaptors are available for varies packages up to 144 pins. New device support will be easier. PC hosted mode and stand-alone mode. Under PC hosted mode the programmer is controlled by a PC via USB2.0 (high speed) to program a chip. Under stand-alone mode the programmer is controlled via the 6-KEY keypad and the 20 character by 4 line LCD display. A SD card is used to store the project files.User can operate multiple units to construct a concurrent multiprogramming system thank for the stand-alone mode. Only IC manufacturer approved programming algorithms are used for high reliability. (+5%~-5%) and (10%~-10%) Vcc verification enhances programming reliability.Advanced and powerful functions.Production mode start chip operation at the moment the chip is inserted in the socket properly.Project function simplifies processes such as device selection, file loading, device configuration setting, program option, and batch file setting into one touch step.Password can be set for project files and production volume controlBatch command combines device operations like program, verify, security into a single command at any sequence.Serial numbers generators are available as standard or customer-specific functions.Log file is useful for quality tracking. Over-current and over-voltage protection for safety of the chip and programmer hardware. WINDOWS XP/Vista/Win7/Win8/Win10 32/64bit compatibility
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SystematIC
Designing and developing 'System on Chip' products involves partitioning of the system into sub-systems or smaller blocks. Many of the blocks will be critical in the performance of the system so it is important to relate product specifications and block specifications correctly. Blocks that are not so specific to a certain system but are generally used in many integration projects we gather and label as 'Auxiliary IP' blocks. The performance of such blocks can also be critical in the system so careful consideration and selection is needed. We are aware the optimal performance-point of a block may be different in each system, for some in low-voltage operation, for others in strong output drive, and so on. Our broad IP portfolio and customization support enables quick application in new IC product developments.
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Teledyne LeCroy
NVM Express is a scalable host controller interface designed to address the needs of Enterprise, Data Center and Client systems for supporting chip-to-chip, board-to-board, adapter and distance solutions. The protocol can efficiently use interconnect and fabric technologies such as PCI Express, Ethernet and Fibre Channel. Teledyne LeCroy provides protocol analysis, emulation, exerciser and other test equipment to service all NVMe storage applications.
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Q7-BT -
ADLINK Technology Inc.
The Q7-BT Computer-On-Module (COM) combines the Qseven® 2.0 standard with the Intel® Atom™ E3800 series System-on-Chip (SoC), providing an ideal solution for mid-range power and high, pin/area density requirements. The module provides the high integration, high performance, low power, and ruggedness favored by Internet-of-Things (IoT) applications such as retail transactional clients, digital signage, and in-vehicle infotainment systems.
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KLA-Tencor Corp
KLA’s defect inspection and review systems cover the full range of yield applications within the chip and wafer manufacturing environments, including incoming process tool qualification, wafer qualification, research and development, and tool, process and line monitoring. Patterned and unpatterned wafer defect inspection and review systems find, identify and classify particles and pattern defects on the front surface, back surface and edge of the wafer. This information allows engineers to detect, resolve and monitor critical yield excursions, resulting in faster yield ramp and higher production yield.
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Ironwood Electronics
Ironwood Electronics SBT sockets are small footprint sockets that are compatible with other product lines such as GHz elastomer sockets, Giga-Spring sockets, etc. The socket needs about 2.5mm extra space around the chip than the actual chip size utilizing only very small PCB real estate. A heat sink screw on the top provides the compression force as well as thermal relief and can be customized to dissipate more power. SBT socket uses SBT contact technology for high endurance and wide temperature applications. SBT Contact is a stamped contact with outside spring as well as inside leaf spring that provides a robust solution for Burn-in & Test applications. Solutions are available for 0.3mm to 1.27mm LGA, BGA, QFN, QFP, SOIC and other packages. Contact technology has 3 part system which includes top plunger, bottom plunger and a spring. The Beryllium Copper plungers are stamped and assembled to a stainless steel spring in an automated system to enable fast turnaround time, low cost and zero defects.
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OpenPleX -
HORIBA, Ltd.
Designed to meet the demands of biologists, biochemists and biophysicists, the OpenPlex is a flexible surface plasmon resonance imaging system.OpenPlex is your companion for the development of label-free and multiplexed bio-assays and molecule detection. It is a robust and compact system designed for simple use and high versatility. Its open format, dedicated sensor chips and manual operation enable numerous types of experiments to be explored without compromise, covering chemistry, biochemistry, physico-chemistry and biomolecular interactions.
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LEC-BW -
ADLINK Technology Inc.
The LEC-BW Computer-On-Module (COM) combines the SMARC® 1.1 standard with the Intel® Pentium® and Celeron® N-series System-on-Chip (SoC), providing an ideal solution for low power consumption and high performance requirements. The module provides the high integration, high performance, low power, and ruggedness favored by Internet-of-Things (IoT) applications such as retail transactional clients, digital signage, and in-vehicle infotainment systems.
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Q7-AL -
ADLINK Technology Inc.
The Q7-AL Computer-On-Module (COM) combines the QSeven® 2.1 standard with the Intel (“Apollo Lake”) Atom® E-series and Pentium® and Celeron® N-series System-on-Chips (SoCs), providing ideal solutions for low power consumption and high pin/area density requirements. The module provides the high integration, high performance, low power, and ruggedness favored by Internet-of-Things (IoT) applications such as retail transactional clients, digital signage, and in-vehicle infotainment systems.
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DTX832-He -
Bacharach, Inc.
The Neutronics DTX832-He Helium in Air Analyzer is for helium in air measurement. With an Ethernet digital communication interface along with 4 to 20 mA output, this analyzer combines ease of use with simple installation, configuration, and integration into DCS and PLC control systems. Used with a well-proven thermal sensor technology that combines the sensor element, signal processing and digital calibration on one small chip, this helium analyzer is an ideal choice for demanding and cost sensitive process control applications.
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UltraZed Family -
AVNET
Embedded boards are boards with processors, multiple integrated circuits, interfaces and other essential components assembled on it to serve a dedicated function. Embedded boards comprise multiple technologies, including processors, core logic, networking, connectivity, and multimedia components to provide functionality and performance for embedded system design applications. Embedded boards and solutions are normally employed to ensure a faster time to market for the developer. Applications of embedded systems vary from tiny portable devices, to large commercial and industrial installations, and even largely complex systems like medical or military or aviation purposes. Embedded boards can have single MCU chip or multiple MCUs depending on the complexity of application.
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FORCE-III -
Seismic Source Co.
The Force 3 Vibrator Control System is the newest generation of vibrator control system. It is designed to control individual vibes, or synchronize entire fleets of trucks. Using GPS, or VHF/UHF radio, for its time base the Force 3 both starts the Vibrator and controls its sweep with unparalleled precision and accuracy.The Force 3 is equipped with the latest ADC chips for better sweep resolution, increased computing power for faster response, GPS for precise source location, 8 Gbytes of internal memory for integrated VSS and PSS data storage, and integrated Wi-Fi for easy data offloading.
